KUCHING: The Perbadanan Insurans Deposit Malaysia (PIDM) is offering 20 bond-free scholarships to Malaysians who are in need of financial aid to pursue their education.
In a press statement issued yesterday, PIDM revealed that the PIDM Undergraduate Scholarship Programme includes the funding of tuition fees and living expenses as well as learning materials.
Successful recipients would undergo an induction and development programme as well as receive mentorship, coaching and internship opportunities.
PIDM added that the closing date for application would be 16 April 2018.
For more information, the general public is encouraged to visit their website at www.pidm.gov.my/en/scholarship.
